SiCarrier, China’s top player in the chip equipment game, is taking bold steps to escalate domestic semiconductor production. At the recent SEMICON 2025 event, they laid out their ambitious plans with the introduction of their newest line of chipmaking tools, hinting at a serious move to rival giants like ASML.
Over the past few years, China’s push to advance its semiconductor capabilities has been noteworthy. Major companies such as Huawei and SMIC have been at the forefront, steadily building the nation’s self-reliant chip production infrastructure. Still, SiCarrier, an important yet less spotlighted player potentially supported by Huawei, now emerges with significant developments in chipmaking tools. Their latest equipment, showcased this year, signals a strong determination to break free from external pressures.
According to @zephyr_z9 on Twitter, SiCarrier is rolling out an impressive array of technologies, including their Rapid Thermal Processing (RTP) tools crucial for IC device fabrication. However, it’s rumored they’re keeping their lithography advances under wraps for now. This strategic expansion is a significant challenge to entities like ASML and Applied, though it remains to be seen how well these innovations will perform in the domestic realm.
Du Lijun, President of SiCarrier, discussed at SEMICON that while their equipment can theoretically produce 5nm chips, the absence of optical tech presents certain hurdles, particularly concerning efficiency and cost. Nonetheless, they are tirelessly collaborating with Huawei and SMIC to unlock solutions, aiming for breakthroughs that could propel China closer to semiconductor self-sufficiency.
Aiming to divert the semiconductor power away from countries with established dominance, SiCarrier has been intensively working on developing EUV technology prototypes with the Shenzhen government and Huawei. These innovations focus on using laser-induced discharge plasma (LDP), potentially paving the way for China to create its own EUV lithography systems. This leap could be critical for China to overcome barriers in crafting its advanced semiconductor nodes.
